Esgee Presenting at This Year’s SPIE Advanced Lithography+Patterning 2022 Conference
SPIE, the international society for optics and photonics, is holding its annual Advanced Lithography & Patterning Conference in San Jose, California from April 24th-28th. This conference gathers a community of experts in semiconductor design and fabrication to...
Esgee to Present at SAE WCX 2022
Esgee Technologies will be presenting at this year’s Society of Automotive Engineers (SAE) WCX World Congress Experience held in Detroit, Michigan from April 5th to 7th. Our paper, “Modeling of Switching Characteristics of Hydrogen-Nitrogen Filled DC Contactor Under...
Esgee to Present at the International Conference on Electric Power Equipment – Switching Technology (ICEPE-ST) 2022
Esgee Technologies will be participating in the 6th International Conference on Electric Power Equipment – Switching Technology (ICEPE-ST 2022), held in Seoul, Republic of Korea. This year’s conference will be held on both live and virtual platforms in a “hybrid”...
Introducing v2.4.1 | Release Update Announcement
We are pleased to announce that the latest version of the OverViz software package has been released! Our latest version of industry leading plasma-fluid-electromagnetic-particle simulation software follows up on our previous v2.4.0 release with bug fixes,...
Introducing v2.4 | Release Announcement
We are pleased to announce that the latest version of the OverViz software package has been released! Many new additions and enhancements have been made to our flagship VizGlow non-thermal and VizSpark thermal plasma solvers. Key New Features and...